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A review on ductile mode cutting of brittle materials

Elijah Kwabena ANTWI, Kui LIU, Hao WANG

Frontiers of Mechanical Engineering 2018, Volume 13, Issue 2,   Pages 251-263 doi: 10.1007/s11465-018-0504-z

Abstract: plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, criticalundeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion

Keywords： ductile mode cutting     brittle materials     critical undeformed chip thickness     brittle-ductile transition    

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Genome-wide association study of the backfat thickness trait in two pig populations

Dandan ZHU,Xiaolei LIU,Rothschild MAX,Zhiwu ZHANG,Shuhong ZHAO,Bin FAN

Frontiers of Agricultural Science and Engineering 2014, Volume 1, Issue 2,   Pages 91-95 doi: 10.15302/J-FASE-2014005

Abstract: Backfat thickness is a good predictor of carcass lean content, an economically important trait, and aIn this study, the candidate genes and genomic regions associated with the tenth rib backfat thicknessThe results indicated that genetic mechanism regulating backfat thickness is complex, and that genome-wide

Keywords： backfat thickness     SNP chip     genome-wide association study     compressed mixed linear model     pig    

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Effects of sheet thickness and material on the mechanical properties of flat clinched joint

Chao CHEN, Huiyang ZHANG, Shengdun ZHAO, Xiaoqiang REN

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 2,   Pages 410-419 doi: 10.1007/s11465-020-0618-y

Abstract: In this paper, the effects of sheet thickness and material on the mechanical properties of the clinchedAl1060 and Al2024 sheets with 2 mm thickness were employed to develop the clinched joint by using differentsheets with 2.5- and 1.5-mm thicknesses were used to produce the clinched joint by using different thicknessThe flat clinching process has a great potential in joining dissimilar and various thickness materials

Keywords： clinched joint     flat clinching process     thickness configuration     material configuration     mechanical property    

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Buffer capacity of granular matter to impact of spherical projectile based on discrete element method

Ying YAN, Pengfei LI, Shunying JI

Frontiers of Structural and Civil Engineering 2013, Volume 7, Issue 1,   Pages 50-54 doi: 10.1007/s11709-013-0186-x

Abstract: Determining a suitable bed thickness is crucial to the buffering effect of granular matter.The first impact peak is independent of bed thickness when the thickness is larger than the criticalthickness.

Keywords： granular matter     impact peak     buffer capacity     discrete element method     critical thickness    

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Frontiers of Mechanical Engineering 2012, Volume 7, Issue 1,   Pages 29-37 doi: 10.1007/s11465-012-0314-7

Abstract: Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chipvibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chipThe flip chip analytical model is revised by considering the influence of spring mass on mechanical energyThis revised model is then applied to estimate the flip chip resonance frequencies.Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection

Keywords： flip chip     defect detection     ultrasonic excitation     vibration analysis    

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Lamellar thickness transition of melt-crystallized polybuten-1 tetragonal phase: configurational change

Motoi YAMASHITA

Frontiers of Chemical Science and Engineering 2009, Volume 3, Issue 1,   Pages 26-32 doi: 10.1007/s11705-009-0002-2

Abstract: Lamellar crystal thickness of isotactic polybutene-1 ( -PB1) have been investigated for crystallizationThe crystal thickness demonstrates two linear dependences on inverse supercooling and a transition

Keywords： isotactic polybutene-1     tetragonal phase     crystal thickness     melt growth     chain folding     small angle X-ray    

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Modeling of the minimum cutting thickness in micro cutting with consideration of the friction around

Tianfeng ZHOU, Ying WANG, Benshuai RUAN, Zhiqiang LIANG, Xibin WANG

Frontiers of Mechanical Engineering 2020, Volume 15, Issue 1,   Pages 81-88 doi: 10.1007/s11465-019-0561-y

Abstract: modeling between the tool and the workpiece plays an important role in predicting the minimum cutting thicknessand clearance faces of the tool; and predict the stagnation point location and the minimum cutting thicknessapplied to calculate the stagnation point location on the edge face and predict the minimum cutting thicknessThe stagnation point and the minimum cutting thickness are also observed and illustrated in the FEM simulationcutting experiments are conducted to validate the accuracy of the friction and the minimum cutting thickness

Keywords： tool friction     minimum cutting thickness     finite element method     tool edge radius     micro cutting    

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Numerical simulation of compaction parameters for sand-filled embankment using large thickness sand filling

Wentao WANG, Chongzhi TU, Rong LUO

Frontiers of Structural and Civil Engineering 2018, Volume 12, Issue 4,   Pages 568-576 doi: 10.1007/s11709-017-0444-4

Abstract: a new technique of highway sand embankment filling in Jianghan Plain district, which can raise the thicknessThe simulation results indicate that the sand-filled layer thickness of 70 cm is suitable for the new

Keywords： sand embankment     compaction in large thickness     numerical simulation     small size vibratory roller     steady    

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Determining the optimum economic insulation thickness of double pipes buried in the soil for district

Fating LI, Pengfei JIE, Zhou FANG, Zhimei WEN

Frontiers in Energy 2021, Volume 15, Issue 1,   Pages 170-185 doi: 10.1007/s11708-020-0680-5

Abstract: The insulation thickness (IT) of double pipes buried in the soil (DPBIS) for district heating (DH) systemsAn optimization model to obtain the optimum insulation thickness (OIT) and minimum annual total cost

Keywords： double pipes     optimization model     optimum insulation thickness     minimum annual total cost    

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Time of flight improved thermally grown oxide thickness measurement with terahertz spectroscopy

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 4, doi: 10.1007/s11465-022-0705-3

Abstract: nondestructive testing technique, terahertz time-domain spectroscopy technology is commonly used to measure the thicknessthermally grown oxide (TGO) reflective wave leads to the measurement failure of natural growth TGO whose thicknessTo detect and monitor TGO in the emergence stage, a time of flight (TOF) improved TGO thickness measurementinvestigation on propagation characteristics of terahertz shows the linear relationship between TGO thicknessThus, the TGO thickness could be obtained efficiently from the TOF increment of the monitor area with

Keywords： thermal barrier coatings     thermally grown oxide     terahertz spectroscopy     time of flight    

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2,   Pages 118-126 doi: 10.1007/s11465-013-0253-y

Abstract:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control

Keywords： LED chip sorter     multi-domain modeling and simulation     parameter optimization     modelica language    

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Optimizing environmental insulation thickness of buildings with CHP-based district heating system based

Yumei ZHANG, Pengfei JIE, Chunhua LIU, Jing LI

Frontiers in Energy 2022, Volume 16, Issue 4,   Pages 613-628 doi: 10.1007/s11708-020-0700-5

Abstract: The increase of insulation thickness (IT) results in the decrease of the heat demand and heat mediumA mathematical model on the optimum environmental insulation thickness (OEIT) for minimizing the annual

Keywords： optimum environmental insulation thickness     heat medium temperature     energy grade     extracted heat     exhaust    

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 581-590 doi: 10.1007/s11465-017-0454-x

Abstract:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set

Keywords： electric field microsensor     three-dimensional     single-chip     in-plane rotation    

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4,   Pages 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 3,   Pages 448-457 doi: 10.15302/J-FASE-2023490

Abstract:

● Low-value biowaste including wood chip and potato peel was valorized

Keywords： Aspen Plus     co-gasification     potato peel     syngas     simulation     waste reduction     wood chip    

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Title Author Date Type Operation

A review on ductile mode cutting of brittle materials

Elijah Kwabena ANTWI, Kui LIU, Hao WANG

Journal Article

Genome-wide association study of the backfat thickness trait in two pig populations

Dandan ZHU,Xiaolei LIU,Rothschild MAX,Zhiwu ZHANG,Shuhong ZHAO,Bin FAN

Journal Article

Effects of sheet thickness and material on the mechanical properties of flat clinched joint

Chao CHEN, Huiyang ZHANG, Shengdun ZHAO, Xiaoqiang REN

Journal Article

Buffer capacity of granular matter to impact of spherical projectile based on discrete element method

Ying YAN, Pengfei LI, Shunying JI

Journal Article

Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Journal Article

Lamellar thickness transition of melt-crystallized polybuten-1 tetragonal phase: configurational change

Motoi YAMASHITA

Journal Article

Modeling of the minimum cutting thickness in micro cutting with consideration of the friction around

Tianfeng ZHOU, Ying WANG, Benshuai RUAN, Zhiqiang LIANG, Xibin WANG

Journal Article

Numerical simulation of compaction parameters for sand-filled embankment using large thickness sand filling

Wentao WANG, Chongzhi TU, Rong LUO

Journal Article

Determining the optimum economic insulation thickness of double pipes buried in the soil for district

Fating LI, Pengfei JIE, Zhou FANG, Zhimei WEN

Journal Article

Time of flight improved thermally grown oxide thickness measurement with terahertz spectroscopy

Journal Article

Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Journal Article

Optimizing environmental insulation thickness of buildings with CHP-based district heating system based

Yumei ZHANG, Pengfei JIE, Chunhua LIU, Jing LI

Journal Article

Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Journal Article

Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Journal Article

SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Journal Article